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  • Study of heat exchange processes in ceramic materials to ensure normal thermal conditions of electronic equipment

    This article discusses the possibility of using ceramic materials with a high coefficient of thermal conductivity as a heat sink material to solve the problem of heat removal in heat-loaded elements of electronic equipment, which will significantly improve the thermal characteristics of the devices and the reliability of their operation.

    Keywords: normal thermal mode, heat and mass transfer, high temperatures, thermal conductivity coefficient, ceramics

  • Friction welding process with mixing of aluminum-lithium alloy 2195

    In this article, the study of the influence of the parameters of friction welding with mixing on the mechanical and microstructural properties of AA2195-T0 and T8 is considered. This article describes the results of an experimental study of the evolution of mechanical properties and microstructure of a friction-stirred welded joint of aluminum-lithium alloy 2195.

    Keywords: friction welding with stirring; process parameters; mechanical properties; aluminum-lithium alloy

  • Reliable 304 stainless steel, laser welded: YAG, for packaging photonic devices

    This article discusses strength testing of welded joints by pulling joint materials using an automated material testing system.

    Keywords: YAG laser welding, packaging of photonic devices, laser processing of materials.

  • Fatigue properties of an advanced high-strength steel plate welded by hybrid plasma arc welding

    This article reports on the use of HPAW in AHS welding in the manufacturing industry. Fatigue durability of welded joints is investigated using these two methods. In addition, to find out the difference in fatigue life, an analysis is carried out both under an optical microscope and under an electron microscope.

    Keywords: high-strength steel, hybrid plasma arc welding, gas arc welding of metal, fatigue, residual stresses

  • Research of electromagnetic pulse spot welding technology without gaskets for electric vehicles

    In this article, the effects of stamping and spot welding at different discharge voltages were studied and the welding effects of spot welding with coils of different widths were compared.

    Keywords: spot welding by electromagnetic pulse, electromagnetic pulse forming, Cu/Al alloy

  • Influence of a heat source from ignition on the calculated combustion curve of polyethylene foam in a fire in a compartment

    This article analyzes the calculated fire curve in accordance with the ignition heat source in the compartment. To predict the calculated fire curve, the exponential equation proposed in the previous study was compared with the heat release rate measured in a fire experiment. The lag index, which is the main factor used to predict the time it will take to reach the maximum heat release rate, has decreased in proportion to the ignition heat source.

    Keywords: fire calculation curve, pipe insulation, ignition heat source, deceleration index, heat release rate

  • Numerical analysis of heat transfer in a multi-pipe configuration for various mixtures of liquids

    In this article, we investigate the effectiveness of using multiple pipes for heat dissipation. The study assumes laminar flow under steady-state conditions. Various mixtures are numerically investigated at different flow rates. Various nanofluids flowing through multiple parallel pipes have been numerically investigated to study the effects of temperature rise. Thanks to the benefits they bring to the cooling process, nanofluids have opened up a new way to improve the performance of thermal systems. A typical nanofluid consists of a base fluid, which is usually water, and nanoparticles.

    Keywords: heat exchanger, flow tube, nanofluid, bottom heating, coefficient of friction, pressure drop

  • Investigation of the influence of the design features of the heat sink on the cooling efficiency of the processor

    The article studies the dependence of the temperature of a heat-loaded element of microelectronics on the parameters of the shape of the heat-removing body. Numerical modeling of the study of the efficiency of the heat-removing surface in terms of reducing the source temperature was carried out in the Ansys Fluent CAD system. The advantage of the heat sink design described in the work is considered to be a fairly high intensity of heat removal from the thermally active region and a small weight, which is provided by the simplicity of the heat sink system and the increased heat transfer rate, which makes it economically advantageous to calculate the use of material and time costs for the manufacture of the product. The increased temperature of electronic equipment elements significantly affects the reliability of their operation. In this paper, the task is to ensure the normal temperature regime of the housing of a heat-loaded microelectronics element using a passive cooling system of a specially designed shape.

    Keywords: heat sink, efficiency of the heat-removing structure, thermal resistance, temperature regime, heat transfer, thermal resistance, heat dissipation, heat-loaded element